heat sink(lsi) - List of Manufacturers, Suppliers, Companies and Products

Heat sink for LSI

Introducing a heat sink developed to dissipate heat generated by the acceleration of CPUs in a more compact space, specifically for LSI applications. ■□■ Features ■□■ ■ A compact design that increases surface area by machining slits into a small heat sink or block to create fin structures with corner pins, resulting in excellent thermal resistance. ■ A heat sink that allows for the free setting of dimensions for height, width, and length, as well as corner pin dimensions, to solve various issues related to space during design. For other functions and details, please contact us.

Company：丸三電機埼玉営業所
Price：Other

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[Free Diagnosis!] LSI Cooler Co., Ltd. Design Support Service

Support from thermal design to provide the right products! Free provision of analysis through simulation software and actual measurement data for thermal countermeasures!

LSI Cooler Co., Ltd. supports thermal design from the outset to provide appropriate products. We have established a system to support thermal design by offering analysis through simulation software and actual measurement data to enable proper thermal countermeasures. We provide more reliable data more quickly, including power-temperature rise characteristics, wind speed-temperature rise characteristics, transient thermal resistance characteristics, pressure loss characteristics, and thermal distribution. We propose suitable costs while shortening development time. 【Features】〇 Providing more reliable data more quickly → Power-temperature rise characteristics → Wind speed-temperature rise characteristics → Transient thermal resistance characteristics → Pressure loss characteristics → Thermal distribution, etc. 〇 Shortening development time and proposing appropriate costs, etc. *Online meetings are also possible, so please feel free to contact us.

Company：LSIクーラー
Price：Other

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Crimp-type heat sink / comb fit

Heat sink compatible with high-output LEDs! Customization available according to application and structure.

As specialists in thermal dissipation and thermal design, we at LSI Cooler provide custom-made LED heat sinks for high light output. We can accommodate a wide range of needs from prototype production to mass production. 【Product Lineup and Features】 ◆ "Comb Fit Heat Sink YK Series" - By innovating the configuration of the fin unit, we can create high-performance natural convection heat dissipation fins in addition to forced air cooling. - The arrangement of fins on the base is flexible, and circular designs are also possible. ◆ "Heat Dissipation Fins for Driver Circuits P Series" - Heat dissipation fins with mounting terminals for TO-220 packages. - A wide variety of standard lineup is available, and dimension customization is possible. ◆ "Design Support" for fin designs tailored to applications - We propose heat dissipation fins tailored to your needs for outdoor, high ceiling, medical, and plant growth lighting, as well as for display boards, floodlights, and fish attracting lights. *Online meetings are also possible, so please feel free to contact us.

Company：LSIクーラー
Price：Other

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Free comprehensive catalog available! Electronic component radiator "heat sink"

Utilizing the excellent thermal conductivity of aluminum for heat dissipation and absorption! Preventing reliability and performance degradation or failure due to temperature rise in semiconductor devices.

Heat sinks are used as practical and economical cooling methods in various industries. This method is adopted in the semiconductor industry as the most practical and economical cooling solution to prevent reliability and performance degradation, as well as destruction due to temperature rise in semiconductor devices. Additionally, the "heat sink" of LSI coolers is characterized by its resistance to vibration, which can also help reduce initial costs. 【Contents】 - V Series: Hollow type (for medium power forced air cooling) - M Series: Multipurpose, general-purpose fin-type heat sinks - H Series: Multipurpose, general-purpose fin-type heat sinks *This download is a digest version. If you would like the complete version, please contact us. *Online meetings are also possible, so feel free to reach out to us.

Company：LSIクーラー
Price：Other

Cooling system

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Flexible heat sink

The heat sink fits the curved surface! The fin shape and size can be customized according to your requirements.

We offer a "Flexible Heat Sink" that elegantly solves the heat dissipation challenges of curved surfaces. The newly conceived variable base structure heat sink allows for flexible deformation to match the curved shapes of cooling targets, such as perfect circles, partially opened shapes, and ellipses. This innovative structure fits even the curved surfaces that were previously difficult to install on, maximizing the heat dissipation effect. 【Specifications】 ■ Material: Aluminum or aluminum alloy ■ Fin shape and size: Custom-made according to your requirements *For more details, please download the PDF or feel free to contact us.

Company：LSIクーラー
Price：Other

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Heat sink, multipurpose, general-purpose F/H/M series

The F/H/M series is an aluminum extruded fin-type heat sink.

We are pursuing high performance in heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most of them consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air convection or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat processing with heat sinks. The multi-purpose, general-purpose F/H/M series heat sinks are aluminum extruded fin-type heat sinks. *Online meetings are also possible, so please feel free to contact us.

Company：LSIクーラー
Price：Other

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Heat sink for high-performance forced air cooling "YK/YU/YX series"

The YK/YU/YX series is a high-performance forced air cooling type with a comb fit design.

We are pursuing high performance for heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. 【Features】〇 Radiators for electronic components that prevent device destruction → Quickly transfers heat for cooling 〇 Composed of a base plate for mounting heat-generating devices and fins for dissipating heat from the base plate 〇 High-performance forced air cooling 〇 Comb-fit type 〇 YK series → Fin-joint type single-sided base 〇 YU series → Fin-joint type single-sided base (narrow pitch) 〇 YX series → Fin-stacked type hollow double-sided base *Online meetings are also possible, so please feel free to contact us.

Company：LSIクーラー
Price：Other

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Heater Comb Fit

The principle of comb-fit coupling is...

The surfaces of the aluminum materials that make up the heat sink's base and fins are covered with a hard oxide film due to exposure to air. By instantly removing this hard oxide film and pressing the newly formed surfaces of the fins and base against each other with pressure, the metal surfaces bond together, improving the thermal conductivity between the base and fins. *Online meetings are also possible, so please feel free to contact us.*

Company：LSIクーラー
Price：Other

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Heat sink for surface mount devices, SQ series

The SQ series is an aluminum extruded type with a slit fin type.

We are pursuing high performance for heat sinks and radiators. The semiconductor devices (such as transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most of them consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air circulation or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat processing with heat sinks. The SQ series heat sinks for surface-mounted devices are made of extruded aluminum and feature a slit fin design. *Online meetings are also possible, so please feel free to contact us.

Company：LSIクーラー
Price：Other

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Heat Sink for Stud-Type Devices S Series

The S series is a heat sink for stud-type devices equipped with aluminum extrusion.

We are pursuing high performance in heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most of them consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to forcibly circulate air or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat treatment with heat sinks. The S series heat sink for stud-type devices is an aluminum extruded type heat sink designed for stud-type devices. *Online meetings are also available, so please feel free to contact us.

Company：LSIクーラー
Price：Other

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Heat sink bonding sheet "Heat Magic"

Ideal for mounting semiconductors such as ICs and LSIs with heat sinks.

It is a sheet that can securely attach a heat sink and enable efficient heat conduction just by sticking it on.

Company：日本ブロアー
Price：Other

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Heat Sink Hollow Type (Medium Power Forced Air Cooling) V Series

The V series is an aluminum extruded type hollow fin heat sink for forced air cooling.

We are pursuing high performance in heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most of them consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves forcing air to circulate using a fan or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat treatment with heat sinks. The hollow-type heat sink (for medium power forced air cooling) V series is an aluminum extruded type hollow fin heat sink for forced air cooling. *Online meetings are also possible, so please feel free to contact us.

Company：LSIクーラー
Price：Other

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Heat sink

Quickly transfers heat.

This is a radiator for electronic components that prevents the destruction of elements by quickly transferring and cooling heat. It typically consists of a base plate for mounting heat-generating elements and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to forcibly circulate air or employing cooling media such as water. *Online meetings are also available, so please feel free to contact us.*

Company：LSIクーラー
Price：Other

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Heat sink for pin-mounted devices, P/FP/U series

The P/FP series is of the aluminum extrusion type, while the U series is of the plate type.

We are pursuing high performance for heat sinks and radiators. Semiconductor devices (such as transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most heat sinks consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. Cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air circulation or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat management with heat sinks. The P/FP/U series of heat sinks for pin-mounted devices consists of the P/FP series, which is an aluminum extrusion type, and the U series, which is a plate type. *Online meetings are also possible, so please feel free to contact us.

Company：LSIクーラー
Price：Other

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Pin-type heat sink K type / Corrugated heat sink S type

Compatible with special shapes! Standard heat sinks suitable for heat dissipation of electronic devices such as ICs and LSIs.

We would like to introduce the "heat sinks" that we handle. There are pin-type and corrugated-type heat sinks, both of which possess excellent heat dissipation characteristics. The pin-type is available from a super compact size of 10mm square, while the corrugated type is particularly lightweight. These are standard heat sinks suitable for heat dissipation of electronic devices such as ICs and LSIs. Both types can accommodate special shapes, so please feel free to consult us. 【Features】 ■ Pin-type - Made of pure aluminum using special die casting - Generates a significant heat dissipation effect relative to its size and weight ■ Corrugated-type - The fin section on the corrugated surface is joined to the base section using a special method - Composed of thin plates, making it ultra-lightweight *For more details, please refer to the PDF document or feel free to contact us.